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// PCBAFORGE BLOG

Engineering Insights & Guides

Technical articles on PCB fabrication, SMT assembly, DFM, testing and PCBA best practices.
ALL MLCC price spike PCBA BOM PCBA BOM risk approved alternates passive component shortage resistor price increase
MLCC and Resistor Spot Quotes Are Jumping 2x-5x: How to Protect a PCBA BOM Through Late August

MLCC and Resistor Spot Quotes Are Jumping 2x-5x: How to Protect a PCBA BOM Through Late August

MLCC and resistor spot quotes are jumping 2x-5x. Learn why this is not a clean shortage story and how PCBA buyers should protect BOMs, alternates and quote windows through late August.
After AI Generates the PCB What Still Needs DFM and Functional Test Review

After AI Generates the PCB What Still Needs DFM and Functional Test Review

AI can speed PCB design but Gerber BOM CPL assembly polarity sourcing risk and functional test requirements still need PCBA review before quote and build.
Why 2026 PCBA RFQs Need Approved Alternates and Inventory Windows

Why 2026 PCBA RFQs Need Approved Alternates and Inventory Windows

Component and freight volatility mean a 2026 PCBA RFQ needs more than Gerbers. Add approved alternates, quote windows, and sourcing rules before you send it.
Why Your Next PCBA RFQ Needs a BOM Risk Plan, Not Just Gerbers

Why Your Next PCBA RFQ Needs a BOM Risk Plan, Not Just Gerbers

A PCBA quote is faster and safer when your Gerber, BOM, CPL, alternates, lifecycle notes, and test requirements arrive together. Here is what to prepare.
Functional Testing for PCBA: Is It Worth the Cost?

Functional Testing for PCBA: Is It Worth the Cost?

Skipping functional testing on your PCBA prototype can cost far more than the test itself. Here's how to decide when you need it — and when you don't.
Controlling Differential Impedance in PCB Manufacturing: From Stackup to TDR Verification

Controlling Differential Impedance in PCB Manufacturing: From Stackup to TDR Verification

Why does your 100Ω differential pair come back as 93Ω? A process engineer's breakdown of every manufacturing variable that shifts impedance — dielectric thickness, Dk variation, etch compensation, copper uniformity — with real numbers and actionable controls.