01
Review hidden connections
Evaluate selected solder-joint conditions that cannot be seen with ordinary visual inspection.
// BGA X-RAY INSPECTION
BGA X-Ray Inspection for Hidden Solder-Joint Review
Use X-ray inspection where solder joints cannot be evaluated visually, with the inspection scope agreed during the assembly review.
ENGINEERING FILE REVIEWPROTOTYPE & SMALL BATCHWORLDWIDE DELIVERY
// SERVICE OVERVIEW
Visibility for area-array packages
BGA and other bottom-terminated packages hide their solder connections beneath the component body. X-ray review can be included in the quality plan for selected devices when package type, board design, assembly risk, and acceptance needs justify it.
02
Target critical packages
Define which BGA, QFN, or other bottom-terminated devices need additional review instead of treating every component the same.
03
Connect findings to the build
Inspection observations can be assessed alongside placement, stencil, reflow, and board-design information.
// HOW TO START
A clear handoff for a faster review
Project workflow
Identify packages and locations requiring X-ray review
Agree the inspection scope and acceptance approach
Inspect the selected assemblies after soldering
Review exceptions before boards proceed to test or shipment
What to send
- Assembly drawing with reference designators
- Package and component information for selected devices
- Any customer-specific acceptance criteria
- Quantity or sampling expectation for the inspection
// COMMON QUESTIONS
BGA X-RAY INSPECTION FAQ
Why is X-ray used for BGA components?
The solder joints are located beneath the package, so they cannot be fully reviewed through direct visual inspection.
Does every assembled board need X-ray inspection?
The appropriate scope depends on package risk, quality requirements, quantity, and the agreed inspection plan.
Can X-ray replace functional testing?
No. X-ray evaluates assembly conditions; functional testing evaluates defined electrical or product behavior. They answer different questions.
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